About Us
ALLVIA, Inc. has built 6,000 square feet of clean room space
and offers a full lineup of wafer processing and Thru-Silicon Via
(TSV) services for customers seeking quick turn custom R&D
applications. Turn Key Solutions as well as single step
processing are available. Time to market can be significantly
reduced by utilizing our Thru-Silicon Via expertise.
and offers a full lineup of wafer processing and Thru-Silicon Via
(TSV) services for customers seeking quick turn custom R&D
applications. Turn Key Solutions as well as single step
processing are available. Time to market can be significantly
reduced by utilizing our Thru-Silicon Via expertise.
Quick Turn in as little as 4 weeks
Over 5 years of via production
Contact us today for a custom solution
6,000 Square Feet of Class 100/1000
Cleanroom
Cleanroom
Send mail to webmaster@allvia.com with questions or comments
about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
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