Advanced Flip-Chip Packaging
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Mounting complex flip-chip die on top of a thru-silicon
stack enables easy access to supporting circuitry.
stack enables easy access to supporting circuitry.
Key Benefits
Reduced impedance
Enhanced power & ground delivery
Better heat dissipation
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about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
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