Company Contact:
info@allvia.com
Phone: 408.720-3343
Fax: 408.720-3334
NEWS RELEASE
ALLVIA opens the first TSV foundry for semiconductor
and MEMS markets
SUNNYVALE, California, November 1, 2007 –
ALLVIA, Inc. has announced that its through silicon
via (TSV) foundry is fully operational and accepting
customer orders.
ALLVIA celebrates 10 years of Thru-Silicon Via
(TSV)development and provides TSV foundry services
to MEMS and Semiconductor industries meeting the
demands of advanced vertical interconnects and
System-in-Package (SiP) solutions. Through Silicon
Vias provide the shortest electrical path between two
sides of Silicon Die, allow miniaturization through 3D
stacking, and support wafer level packaging (WLP) for
RF and MEMS devices. With a full line of in-house
processing equipment, Allvia offers services for
prototyping as well as low volume production runs.
ABOUT ALLVIA, Inc.
ALLVIA, Inc. has built 6,000 sq. ft. of clean room
space and offers a full lineup of wafer processing and
Thru-Silicon Via foundry services for customers
seeking quick turn custom R&D applications. Time to
market can be significantly decreased by utilizing
ALLVIA’s Thru-Silicon Via expertise.