About ALLVIA, Inc

Company Background

ALLVIA, Inc. offers a full lineup of Silicon Interposer processing and Through-Silicon Via (TSV) services for customers seeking quick turn custom R&D applications. Turn Key Solutions as well as single step processing are available. Time to market can be significantly reduced by utilizing our Through-Silicon Via expertise.

  • Quick Turns in as little as 4 weeks
  • Over 5 years of via production
  • Contact us today for a custom solution