ALLVIA, Inc., Through-Silicon Via (TSV) Foundry Services in Silicon Valley California

Foundry Services
	Via Design
	Via Deep Etching
	Via Copper Filling
	Via Backside Opening
	Via Die Attaching

In the News...

Mar. 17, 2010 Silicon Interposers Webcast. In this Webcast three engineers discuss the evolution of interposers with TSVs. View the recorded Webcast.

Feb. 23, 2010 3D Integration Breakthrough - ALLVIA Integrates Embedded Capacitors for Silicon Interposers and 3D Stacked Semiconductors

Jan. 13, 2010; ALLVIA Completes Reliability Testing of Silicon Interposer for Stacked Semiconductors

Dec. 1, 2009; ALLVIA to Present Critical Results in TSV Design, Process and Reliability at 3D Packaging Forum.

Oct. 22, 2009; ALLVIA has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology.

ALLVIA, Inc. provides Through-Silicon Via (TSV) foundry services to MEMS and Semiconductor industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

These void-free copper posts illustrate ALLVIA's ability to successfully fill vias with challenging dimensions.We can fill vias with diameters as small as 30µ and depths to 500µ. Our 25,000 s.f. clean room facility can service prototypes and small production runs.