MEMS Cap Wafer
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Thru-silicon connections surrounding a cavity allows
MEMS devices to be hermetically sealed against
the elements while maintaining convenient access
to the outside world.
MEMS devices to be hermetically sealed against
the elements while maintaining convenient access
to the outside world.
Key Benefits
Connections through hermetical seal
Allows wafer level packaging
Total package size reduction
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about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
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