ALLVIA Opens World's First TSV Foundry for Semiconductor and MEMS Markets

Development Facility in Silicon Valley

Sunnyvale, California, 10 June, 2004

ALLVIA has opened a facility for joint TSV development projects with customers in the heart of Silicon Valley. The facility represents an investment of more than $6 million and will serve as the primary location for support for customers throughout the world. The lab is a 6000 sq. ft., class 100 facility. Capabilities include development for silicon via etching, via copper plating, CMP, 3D stacking, system in a package (SiP) development for RF, MEMS and semiconductor applications.

ALLVIA, Inc. provides Through-Silicon Via R&D services to semiconductor, RF and MEMS industries in order to meet increasing demands for advanced vertical interconnects and System-in-Package (SiP) solutions. Through vias allow for the shortest electrical path between two sides of wafers or dice, used for 3D die-to-die or die-to-wafer or wafer-to-wafer stacking as well as for RF and MEMS wafer level packaging (WLP). A full line of in-house processing equipment offers quick turnaround of custom through wafer via manufacturing and testing. Low volume production runs can also be accommodated.

About ALLVIA

Located in Silicon Valley, ALLVIA (http://www.allvia.com/) is the first through-silicon via (TSV) foundry. ALLVIA introduced the term, through-silicon via, in a 1997 business plan and a January 2000 technical article. ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.