Sunnyvale, California, 10 June, 2004
ALLVIA has opened a facility for joint TSV development projects with customers in the heart of Silicon Valley. The facility represents an investment of more than $6 million and will serve as the primary location for support for customers throughout the world. The lab is a 6000 sq. ft., class 100 facility. Capabilities include development for silicon via etching, via copper plating, CMP, 3D stacking, system in a package (SiP) development for RF, MEMS and semiconductor applications.
ALLVIA, Inc. provides Through-Silicon Via R&D services to semiconductor, RF and MEMS industries in order to meet increasing demands for advanced vertical interconnects and System-in-Package (SiP) solutions. Through vias allow for the shortest electrical path between two sides of wafers or dice, used for 3D die-to-die or die-to-wafer or wafer-to-wafer stacking as well as for RF and MEMS wafer level packaging (WLP). A full line of in-house processing equipment offers quick turnaround of custom through wafer via manufacturing and testing. Low volume production runs can also be accommodated.
Company Contact: |
Agency Contact: |
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ALLVIA, Inc.
info@allvia.com 408.212.3200 657 N. Pastoria Ave. Sunnyvale, CA 94085 USA |
Kirkpatrick Comunications, Inc.
Bruce Kirkpatrick bruce@kirk-com.com 925.244.9100 |