ALLVIA, Inc. offers a full lineup of wafer processing and Through-Silicon Via foundry services for customers seeking quick turn custom R&D applications. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as low volume production runs.

Through Silicon Vias (TSV) as a term was introduced in 1997. TSVs allow for the shortest electrical path between two sides of wafers or die, used for 3D die-to-die, die-to-wafer, or wafer-to-wafer stacking as well as for RF and MEMS wafer level packaging (WLP).