ALLVIA, Inc. has developed a proprietary technique to enable die with tight pitch vias to be easily attached to other silicon die or plastic substrates.

Key Benefits

• Easy alignment of parts
• High reliability of connections
• Ni Au plated posts

More Photos

Cross section of bumped wafer with TSV	Bumping of TSV on the backside
Bumping of TSV on the backside	Silicon interposer attached to BT substrate