ALLVIA, Inc. has in-house capability to open blind vias from the backside of a wafer. Silicon is removed and via posts are extended past the backside of the wafer as far as required by the subsequent attaching method. Extending via posts 50 um, 75 um, or 100 um is no problem for our equipment.

Key Benefits

• Vias exposed to any depth
• Damage free wafer backsides
• Insulation layer remains intact