VIA Attaching
{Back to Services} {UP}
{Back to Services} {UP}
ALLVIA, Inc. has developed a proprietary technique to
enable die with tight pitch vias to be easily attached to
other silicon die or plastic substrates.
enable die with tight pitch vias to be easily attached to
other silicon die or plastic substrates.
Key Benefits
Easy alignment of parts
High reliability of connections
Ni Au plated posts
Send mail to webmaster@allvia.com with questions or comments
about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
Open the Next
Dimension
Dimension
 |
| |
 |
| |
 |
| |
 |
| |
 |
