VIA Drilling
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ALLVIA, Inc. has in-house capability to drill blind vias into a
wafer. Diameters as small as 10 um with depths as large as
500 um are possible.
wafer. Diameters as small as 10 um with depths as large as
500 um are possible.
Key Benefits
Uniform via dimensions over entire wafer
Tight pitch and small diameters
Vertical walls
Send mail to webmaster@allvia.com with questions or comments
about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
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