VIA Opening
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ALLVIA, Inc. has in-house capability to open blind vias from
the backside of a wafer. Silicon is removed and via posts are
extended past the backside of the wafer as far as required by
the subsequent attaching method. Extending via posts 50 um,
75 um, or 100 um is no problem for our equipment.
the backside of a wafer. Silicon is removed and via posts are
extended past the backside of the wafer as far as required by
the subsequent attaching method. Extending via posts 50 um,
75 um, or 100 um is no problem for our equipment.
Key Benefits
Vias exposed to any depth
Damage free wafer backsides
Insulation layer remains intact
Send mail to webmaster@allvia.com with questions or comments
about this web site. Copyright © 2004 ALLVIA, Inc.
about this web site. Copyright © 2004 ALLVIA, Inc.
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Dimension
Dimension
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Filled & Opened
Via 65 um Wide
150 um Deep
Via 65 um Wide
150 um Deep
