ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.


ALLVIA, a leader in TSV development, provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.


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allvia photos
These void-free copper posts illustrate ALLVIA's ability to successfully fill vias with challenging dimensions.We can fill vias with diameters as small as 30µ and depths to 500µ. Our 25,000 s.f. clean room facility can service prototypes and small production runs.

NEWS


June 28, 2016;   ALLVIA launches new product lines for Through Glass Vias (TGV) and Through Quartz Vias (TQV)

Sunnyvale facility triples its capacity with state-of-the-art equipment to accommodate its expansion from Through Silicon Vias (TSVs) to TGVs and TQVs. more ››


Who coined the term TSV?

Read Moore's Law, the Z Dimension, an article by Sergey Savastiouk that first appeared in the January 2000 issue of Solid State Technology magazine. (PDF, 243k) May 29, 2012   ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.

September 28, 2011   ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Microelectronics in Long Beach, CA, October 11. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Embedded Capacitors on Silicon Interposers Enable Higher Frequency Applications."

// hidden from view 2/27/2013 // to be replaced with a new press release about ISO 9000 certification

Jul 8, 2011   ALLVIA has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs. The registration certifies the company's dedication as a trusted U.S. facility to adhering to regulations that control the export and import of defense-related products and services.

Mar 1, 2011   ALLVIA will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Silicon Interposers Enable High Performance Capacitors."

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