Through-Silicon Via (TSV) Foundry
Open the Next Dimension
ALLVIA, Inc. provides Through-Silicon Via (TSV) foundry services to MEMS and Semiconductor industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.
These void-free copper posts illustrate ALLVIA's ability to successfully fill vias with challenging dimensions.We can fill vias with diameters as small as 30µ and depths to 500µ. Our 25,000 s.f. clean room facility can service prototypes and small production runs.
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