ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego
Sunnyvale, California, May 29, 2012
ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.