3D Integration Breakthrough - ALLVIA Integrates Embedded Capacitors for Silicon Interposers and 3D Stacked Semiconductors

ALLVIA, the first through-silicon via (TSV) foundry, has integrated embedded capacitors on Silicon Interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. Capacitance values higher than 1,500 nF/cm2 have been achieved for the embedded capacitors developed for delivering power to the devices. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

First Through-Silicon Via Foundry, ALLVIA, Completes Reliability Testing of Silicon Interposer For Stacked Semiconductors

ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic or ceramic substrate and completed full reliability testing. This 3D integration of substrates is all made possible with ALLVIA's through-silicon vias. Samples and reliability data are now being made available to interested customers.

First Through-Silicon Via Foundry, ALLVIA, to Present Critical Results in TSV Design, Process and Reliability at 3D Packaging Forum

ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on via processing and reliability during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled TSV Technology Implementation – Design, Process, and Reliability Studies for Product Applications.

Finally! A Semiconductor Technology Company is Expanding. Through-Silicon Via Foundry, ALLVIA, Acquires Manufacturing Site in Oregon

Semiconductor equipment tool selection process to begin shortly; benefits of Oregon manufacturing expansion include talent pool and lower operating costs

ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of cleanroom capacity. The cleanroom is expandable to 80,000 square feet.

First Through-Silicon Via Foundry, ALLVIA, Selects SunSil for Semiconductor Sales and Marketing Support in the U.S.

Recent through-silicon via (TSV) work with interposers and new funding spark ALLVIA's expansion

ALLVIA, the first through-silicon via (TSV) foundry, has hired SunSil Inc. to sell and market their products and services in the United States. SunSil is a global technical sales and marketing company representing leading semiconductor equipment, materials and manufacturing services companies. With significant industry experience on staff, SunSil has two Silicon Valley locations and offices worldwide.