ALLVIA Adds Capabilities for Through-Quartz Vias, Reducing Foundry Cycle Times and Improving Interposer Product Quality
PRESS RELEASE
Sunnyvale, California, May 1, 2018
To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep. ALLVIA's new TQV solution significantly improves the performance of 3D-ICs by creating IC interconnects with lower parasitic capacitance than can be achieved with the earlier generation of through-silicon via (TSV) technology.
ALLVIA launches new product lines for Through Glass Vias (TGV) and Through Quartz Vias (TQV)
PRESS RELEASE
Sunnyvale, California, June 28, 2016
Leveraging significant presence in TSV markets ALLVIA, Inc. has expanded its capacity into Glass and Quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers. This will enable next-generation semiconductor 2D and 2.5 D packaging solutions using ultra-thin glass and quartz.
ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego
PRESS RELEASE
Sunnyvale, California, May 29, 2012
ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.
ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at IMAPS 2011
PRESS RELEASE
Sunnyvale, California, September 28, 2011
ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Microelectronics in Long Beach, CA, October 11. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Embedded Capacitors on Silicon Interposers Enable Higher Frequency Applications."
ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at Packaging Forum
PRESS RELEASE
Sunnyvale, California, March 1, 2011
ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Silicon Interposers Enable High Performance Capacitors."
ALLVIA to Present Advanced Logic Applications for Silicon Interposers and Embedded Capacitors at 3D Packaging Forum
PRESS RELEASE
Sunnyvale, California, December 6, 2010
ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled: "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications".
Silicon Interposers with Through-Silicon Vias and Thin-film Capacitors
WEBCAST
ALLVIA hosted a webcast on how to build silicon interposers with embedded capacitors in 3D stacked semiconductors. The webcast took place March 17, 2010. The Webcast is available for viewing online.
3D Integration Breakthrough - ALLVIA Integrates Embedded Capacitors for Silicon Interposers and 3D Stacked Semiconductors
PRESS RELEASE
Sunnyvale, California, Feb. 23, 2010
ALLVIA, the first through-silicon via (TSV) foundry, has integrated embedded capacitors on Silicon Interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. Capacitance values higher than 1,500 nF/cm2 have been achieved for the embedded capacitors developed for delivering power to the devices. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.
First Through-Silicon Via Foundry, ALLVIA, Completes Reliability Testing of Silicon Interposer For Stacked Semiconductors
PRESS RELEASE
Sunnyvale, California, Jan. 13, 2010
ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic or ceramic substrate and completed full reliability testing. This 3D integration of substrates is all made possible with ALLVIA's through-silicon vias. Samples and reliability data are now being made available to interested customers.
First Through-Silicon Via Foundry, ALLVIA, to Present Critical Results in TSV Design, Process and Reliability at 3D Packaging Forum
PRESS RELEASE
Sunnyvale, California, Dec. 1, 2009
ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on via processing and reliability during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled TSV Technology Implementation – Design, Process, and Reliability Studies for Product Applications.
Finally! A Semiconductor Technology Company is Expanding. Through-Silicon Via Foundry, ALLVIA, Acquires Manufacturing Site in Oregon
Semiconductor equipment tool selection process to begin shortly; benefits of Oregon manufacturing expansion include talent pool and lower operating costs
PRESS RELEASE
Sunnyvale, California, Oct. 22, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of cleanroom capacity. The cleanroom is expandable to 80,000 square feet.
First Through-Silicon Via Foundry, ALLVIA, Selects SunSil for Semiconductor Sales and Marketing Support in the U.S.
Recent through-silicon via (TSV) work with interposers and new funding spark ALLVIA's expansion
PRESS RELEASE
Sunnyvale, California, July 7, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has hired SunSil Inc. to sell and market their products and services in the United States. SunSil is a global technical sales and marketing company representing leading semiconductor equipment, materials and manufacturing services companies. With significant industry experience on staff, SunSil has two Silicon Valley locations and offices worldwide.
Some Good News - Investment in the First Through-Silicon Via Foundry, ALLVIA, Inc., Grows to $25 Million with Next Round of Funding
PRESS RELEASE
Sunnyvale, California, 4 February, 2009;
ALLVIA, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in its next round of funding to expand manufacturing facilities and to build more capacity. This brings the total funding invested in the company to $25 million.
